TechMicrosoft Maia 300: 96 Chips, 167 kW Racks and a Multi-Gigawatt 2027 RolloutMicrosoft's third-gen Maia 300 AI chip uses TSMC N2P and 288GB of HBM4. Specs, the 167 kW rack maths, 2027 rollout and what's unverified.Oct 13, 2026